Hiseshisho-kun
It is a handling device for non-contact transportation of semiconductor silicon wafers, such as glass.
"Hiseshsho-kun" is a handling device for non-contact transportation of semiconductor silicon wafers, such as glass. The suction part of "Hiseshsho-kun" does not come into contact with the transported items like wafers, and they are transported in a floating state with air in between. "Hiseshsho-kun" solves the following problems: * Cross-contamination * Damage or scratches on wafers * Handling of ultra-thin wafers * Point contact retention of wafers * Wafer transportation mechanism * Wafer levitation
- Company：佐々木工機
- Price：Other
